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Computer Science

DDR5’s Secret Weapon: On-Die Termination (ODT) for Noise Reduction and Power Efficiency

DDR5’s Secret Weapon:On-Die Termination (ODT) for Noise Reduction and Power Efficiency

Enhancing data reliability and performance: Exploring On-die termination (ODT) in DDR5 memory

Signal integrity is more important as data is delivered at faster speeds in DDR5 memory. When there is an imbalance between the characteristic impedance of the transmission line and the impedance of the connected devices, signal reflections may happen. DDR5 (Double Data Rate 5) memory modules and other high-speed digital systems use the on-die termination (ODT) technology to lessen signal reflections and enhance signal integrity.

By placing a termination resistor that matches the transmission line’s impedance right on the memory chip, on-die termination minimizes the possibility of signal reflections. Therefore, ODT is a crucial component for high-speed DDR5 memory systems since it aids in enhancing signal quality, decreasing signal ringing, and eventually allowing for higher data transfer speeds with less signal deterioration.  

To other circuity like RCV: DQ, DS, DM, TDQS

[Source: DDR5 Standard [JEDEC JESD79-5B_v1.20] Page 346 of 502]

P.S. You can refer to DDR5 Standard [JEDEC JESD79-5B_v1.20]: https://www.jedec.org/sites/default/files/docs/JESD79-5B_v1-2.pdf for further studies.     

With on-die termination (ODT), the termination resistor for transmission line impedance matching is housed inside a semiconductor chip as opposed to a printed circuit board (PCB). This termination resistor can be dynamically enabled or disabled depending on the settings of the memory controller and the particular needs of the memory bus.   

Types of On-Die Termination (ODT) in DDR5

There are two primary ODT implementation types in DDR5 memory:

ODT in parallel (PODT)

The conventional ODT technique used in earlier DDR memory generations is called Parallel On-Die Termination. The data lines on the memory chip are connected in parallel with a fixed termination resistor in PODT. Regardless of whether the ODT is activated or disabled, this resistor offers a constant impedance to the data lines. On a memory module, the termination value is commonly selected to match the characteristic impedance of the transmission lines.

Dynamic On-Die Termination (DODT)

It is a more sophisticated ODT technology that was introduced with DDR5 memory. When using DODT, the termination impedance can be changed dynamically, in contrast to PODT. According to the settings of the memory controller and the precise data transfer requirements at any given time, the termination resistor can be changed or turned on or off. With the aid of this dynamic management, signal integrity can be improved for a range of data rates and load situations.

PODT v. DODT

Parallel ODT:

  • The termination impedance in parallel ODT is constant and does not fluctuate.
  • In order to change between high and low termination impedances, a mode register set instruction is necessary.
  • The termination resistor is positioned on the motherboard in this example of the termination method.

Dynamic ODT:

  • The DRAM may flip between high and low termination impedance thanks to dynamic ODT without requiring a mode register set instruction.
  • It gives systems more freedom to choose the best termination values under various loading scenarios.
  • Without executing a mode register set instruction, it enables the DRAM to alternate between high and low termination impedance.
  • It simplifies and lowers the cost of the system design by reducing the amount of complicated wire and resistor parts on the motherboard.

In conclusion, the primary distinction between parallel ODT and dynamic ODT is that the former has a fixed termination impedance while the latter enables dynamic impedance switching without the requirement of a mode register set instruction. Increased flexibility and optimization for various loading circumstances are provided by dynamic ODT.

Key features of ODT in DDR5

Certainly! On-Die-Termination (ODT), which plays a critical part in guaranteeing dependable and effective high-speed data transmission, is particularly significant in DDR5 memory. ODT addresses several significant issues that develop as data transmission rates climb in contemporary memory systems. The following are the primary implications of ODT in DDR5:

Signal Reflection Reduction

Due to the nature of high-speed digital transmissions, signal reflections and impedance mismatches occur when data signals are carried across the memory bus. These reflections may deteriorate the quality of the delivered data and distort the signal. To lessen signal reflections and minimize data errors, ODT offers termination resistors that are directly attached to the memory chips and match the characteristic impedance of the transmission lines.

Data Reliability

Due to DDR5’s faster data transfer speeds, there is also a greater chance of data mistakes and corruption. Data distortions and signal ringing are reduced by proper termination utilizing ODT, resulting in more dependable data transfer and a lower probability of memory-related mistakes. ODT improves memory performance by allowing memory modules to run at their full specified speeds by reducing signal reflections and distortions.

Noise reduction

ODT aids in the memory system’s ability to filter out noise and electromagnetic interference (EMI). For signal quality to be maintained and to prevent data corruption or system instability, noise reduction is essential.

Power Efficiency

The Dynamic On-Die Termination (DODT) feature of DDR5 memory enables dynamic management of the termination impedance. DODT optimizes power usage by changing the termination parameters in accordance with the demands of the data transfer. The amount of unnecessary power dissipation is reduced, making the memory system more power-efficient.

Flexibility  

DODT provides more flexibility in memory operations because it is a dynamic implementation of ODT. Memory controllers offer superior adaptability to changing circumstances by adjusting termination settings for various memory configurations, data rates, and system loads.

Intellectual property trends for ODT

ODT in DDR5 is witnessing rapid growth in patent filing trends across the globe. Over the past few years, the number of patent applications almost getting doubled every two years.   

MICRON is a dominant player in the market with ~426 patents. So far, it has 2 times more patents than Intel. AMD is the third-largest patent holder in the domain.

Other key players who have filed for patents in DDR5 technology with ODT are SK Hynix, NVDIA, Samsung, IBM, Qualcomm and IBM.

Other key players who have filed for patents in DDR5 technology with ODT are SK Hynix, NVDIA, Samsung, IBM, Qualcomm and IBM

[Source: https://www.lens.org/lens/search/patent/list?q=on-die%20termination%20on%20DDR5%20memory]

Following are the trends of publication and their legal status over time:

[Source: https://www.lens.org/lens/search/patent/list?q=on-die%20termination%20on%20DDR5%20memory] 

These Top 10 companies own around 54% of total patents related to HBM. The below diagram shows these companies have built strong IPMoats in US jurisdiction, followed by China, European, Korea, and Germany jurisdiction.

[Source: https://www.lens.org/lens/search/patent/list?q=on-die%20termination%20on%20DDR5%20memory]

Conclusion

ODT is becoming more and more important as memory technologies develop. Strong signal integrity and effective data transmission become more crucial with each new memory generation and higher data rates. The use of ODT in DDR5 helps memory systems be prepared for future increases in performance and data transfer speeds. In conclusion, ODT helps to provide a stable and dependable memory system that can support the needs of contemporary computer applications by reducing signal reflections and noise.

Categories
Semiconductors

Different Semiconductor Packaging Technology

Blog Cover - Semiconductor

Semiconductor packaging

Semiconductor packaging is a crucial component of modern electronics fabrication since it protects and connects integrated circuits to the outside world. IC packaging has developed to satisfy the demands of many applications as electronic devices have grown smaller, quicker, and more adaptable. This article discusses the various kinds of semiconductor packaging, and their significance, used for manufacturing in the semiconductor industry.

Types of Semiconductor Packaging

Semiconductor packaging entails enclosing the semiconductor die within a protective package may be made of ceramic or plastic and connecting the device electrically. The packaging type chosen is determined by criteria such as form factor, thermal concerns, electrical performance, and cost. Here are some examples of several different types of IC packaging:

different types of IC packaging
  • Dual In-line Package (DIP): DIP is one of the oldest semiconductor packaging types, and it remains popular in the industry. It is inserted through the hole-type package in the circuit board. Its pin counts range from 8 to 64.
  • Quad Flat Package (QFP): QFP is a surface-mount package that is rectangular in shape and has leads protruding from all four sides. QFP packages are offered in pin counts ranging from 32 to 304.
  • Small Outline J-lead Package (SOJ): SOJ is a surface-mount package that features J-shaped leads on both sides. SOJ packages are available with pin counts ranging from 8 to 44.
  • Pin Grid Array (PGA): PGA is a through-hole package with pins positioned on the bottom of the package in a grid arrangement. PGA packages come in a variety of pin counts, ranging from 84 to 1,520.
  • Ball Grid Array (BGA): BGA is surface-mount type packaging in which pins in the earlier packaging are replaced with a variety of solder balls. BGA packets come in a variety of ball counts, ranging from 4 to 2,500.
  • Wafer-Level Packaging (WLP): WLP is a packaging method that involves encapsulating the ICs at the wafer level before being divided into individual chips. WLP packages come in a variety of sizes, ranging from 1 mm to 10 mm. Examples include RDL-based, flip-chip, and TSV-based packages. There are main two types of Wafer-level Chip-Scale Packages (WLCSP) that are Fan-In WLCSP and Fan-out WLCSP. Wherein the word “Fan” refers to the chip’s size.
  • Fan-In WLCSP: The Fan-In WLCSP includes the insulating layer, solder balls right on top of the wafer, and package wiring all contributing to the different benefits of a fan-in WLCSP. It has an interposer that is the same size as the die. The electrical transmission channel is relatively short since the solder balls are connected to the chip directly rather than through a medium like a substrate, which enhances electrical properties.
  • Fan-out WLCSP: Fan-out WLCSP overcomes the drawbacks of fan-in WLCSP while retaining its benefits. Fan-out WLCSP has package-mounted solder balls that can be “fanned out” away from the chip. The interposer’s size is the same as that of the die. It also offers good electrical characteristics like FI-WLCSP.
Importance of IC packaging

Importance of IC packaging:

  1. Electrical Performance: The packaging has an impact on the device’s electrical properties, and well-designed packaging reduces signal deterioration and improves overall performance.
  2. Thermal Control: Modern ICs produce a lot of heat. Heat dissipation is facilitated by efficient packaging designs, which helps avoid overheating and ensures long-term dependability.
  3. Form Factor & Size: As electronics get smaller and more portable, miniature packaging techniques make it possible to make devices that are svelte and tiny.
  4. Protection: Different packaging types protect the IC from various conditions including moisture, dust, and temperature changes. The packaging acts as a shield to protect the semiconductor die from these factors.
  5. Interconnect Density: The number of interconnects that may be accommodated depends on the kind of packaging. Complex interconnections are made possible by high-density packing, such as BGAs and CSPs, which is essential for contemporary electronics.

Techinsights images of Wafer level chip scale-type packaging

Samsung Exynos 9110 Processor

Figure 1 Samsung Exynos 9110 Processor (Source)

Apple A14 Bionic Processor (APL1W01)
Apple A14 Bionic Processor (APL1W01)

Figure 2 Apple A14 Bionic Processor (APL1W01) (Source)

IP Trends in Wafer-Level Chip Scale Packaging in Semiconductor

As the importance of packaging is increasing, there is a rapid growth in the patent filing trends witnessed across the globe. The Highest number of patents granted was in 2020 with 3339 patents and the highest number of patent applications filed was ~4553 in 2022.

IBM is a dominant player in the market with ~9319 patent families. So far, it has 1.5 times more patent families than TSMC, which comes second with 5686 patent families. Samsung is the third-largest patent holder in the domain.

Other key players who have filed for patents in WLCSP technology are Intel, Micron, Globalfoundries, SanDisk, Infineon Technology, SK Hynix and so more.

Key players who have filed for patents in WLCSP technology

(Source: Lens.org)

Legal status of patent applications
Patent Documents over Time with Publiation Date

(Source: Lens.org)

Conclusion

IC packaging is a crucial step in the semiconductor business because it shields semiconductor components from corrosion and physical harm from the outside world. The many distinct varieties of IC packages are based on various circuit designs and requirements for the outside shell. The most popular IC packaging designs are wafer-level packaging, pin grid arrays, dual in-line packages, quad flat packages, compact outline J-lead packages, and chip carriers. The IC package you choose depends on the particular application requirements.

Categories
Mechanical

Intellectual Property and ChatGPT: Navigating the Ethical Landscape

Chatgpt, intellectual property

As cutting-edge artificial intelligence chatbots become progressively modern, they are bringing up significant questions about IPR law and its application to these new advances. Specifically, there are worries about the ownership of content produced by artificial intelligence chatbots, and how to protect and manage the content made by AI.

One main point of interest is the degree to which artificial intelligence chatbots can be thought of as “creators” of original content for reasons of copyright regulation. As these frameworks become further developed, they can produce even better pictures, texts, and different types of content that are indistinguishable from content made by humans. This brings up issues about who should be thought of as the “creator” of the substance for copyright, and whether such content ought to be qualified to be given similar IP rights.

As a rule, copyrighted materials are made by human creators and are considered original content that is fixed in a substantial form. This implies that the work should be communicated in a physical or computerized form, like a book, a PC file, or a painting, to be safeguarded by intellectual property law. With regards to artificial intelligence chatbots, it is not clear whether the substance produced by these frameworks would be viewed as original and fixed in a substantial form, and consequently qualified for copyright protection law.

Cheap and cheerful: why ChatGPT is no trademark filer | Managing Intellectual Property

Some might contend that artificial intelligence is simply a tool or instrument that is utilized by human creators for work, and subsequently, the human creator ought to be viewed as the original maker and proprietor of the work. Others might contend that computer-based intelligence itself ought to be viewed as the maker and proprietor of the work, provided its capacity to produce unique substance without any intervention by a human.

It is challenging to say for certain whether the substance produced by computer-based intelligence would be qualified for copyright law under existing regulations. Nonetheless, the rise of these advancements brings up significant questions and difficulties that should be addressed to guarantee that IP rights are safeguarded.

Another issue is the potential for IP infringement by artificial intelligence chatbots. As these frameworks become all the more broadly utilized, there is a gamble that they may coincidentally or purposefully produce content that encroaches on the Intellectual Property rights of others or that is duplicative of other artificial intelligence-created content. For instance, an AI chatbot that produces text or pictures in light of previous work without consent could be considered encroaching.

The development of cutting-edge artificial intelligence devices raises significant concerns related to IP that should be addressed to guarantee that these innovations are utilized ethically and that respect the rights of human creators. Technologists, attorneys, and policymakers should cautiously consider these issues and work together to foster fitting legal structures for the utilization of artificial intelligence in the production of original content.