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Semiconductors

Different Semiconductor Packaging Technology

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Semiconductor packaging

Semiconductor packaging is a crucial component of modern electronics fabrication since it protects and connects integrated circuits to the outside world. IC packaging has developed to satisfy the demands of many applications as electronic devices have grown smaller, quicker, and more adaptable. This article discusses the various kinds of semiconductor packaging, and their significance, used for manufacturing in the semiconductor industry.

Types of Semiconductor Packaging

Semiconductor packaging entails enclosing the semiconductor die within a protective package may be made of ceramic or plastic and connecting the device electrically. The packaging type chosen is determined by criteria such as form factor, thermal concerns, electrical performance, and cost. Here are some examples of several different types of IC packaging:

different types of IC packaging
  • Dual In-line Package (DIP): DIP is one of the oldest semiconductor packaging types, and it remains popular in the industry. It is inserted through the hole-type package in the circuit board. Its pin counts range from 8 to 64.
  • Quad Flat Package (QFP): QFP is a surface-mount package that is rectangular in shape and has leads protruding from all four sides. QFP packages are offered in pin counts ranging from 32 to 304.
  • Small Outline J-lead Package (SOJ): SOJ is a surface-mount package that features J-shaped leads on both sides. SOJ packages are available with pin counts ranging from 8 to 44.
  • Pin Grid Array (PGA): PGA is a through-hole package with pins positioned on the bottom of the package in a grid arrangement. PGA packages come in a variety of pin counts, ranging from 84 to 1,520.
  • Ball Grid Array (BGA): BGA is surface-mount type packaging in which pins in the earlier packaging are replaced with a variety of solder balls. BGA packets come in a variety of ball counts, ranging from 4 to 2,500.
  • Wafer-Level Packaging (WLP): WLP is a packaging method that involves encapsulating the ICs at the wafer level before being divided into individual chips. WLP packages come in a variety of sizes, ranging from 1 mm to 10 mm. Examples include RDL-based, flip-chip, and TSV-based packages. There are main two types of Wafer-level Chip-Scale Packages (WLCSP) that are Fan-In WLCSP and Fan-out WLCSP. Wherein the word “Fan” refers to the chip’s size.
  • Fan-In WLCSP: The Fan-In WLCSP includes the insulating layer, solder balls right on top of the wafer, and package wiring all contributing to the different benefits of a fan-in WLCSP. It has an interposer that is the same size as the die. The electrical transmission channel is relatively short since the solder balls are connected to the chip directly rather than through a medium like a substrate, which enhances electrical properties.
  • Fan-out WLCSP: Fan-out WLCSP overcomes the drawbacks of fan-in WLCSP while retaining its benefits. Fan-out WLCSP has package-mounted solder balls that can be “fanned out” away from the chip. The interposer’s size is the same as that of the die. It also offers good electrical characteristics like FI-WLCSP.
Importance of IC packaging

Importance of IC packaging:

  1. Electrical Performance: The packaging has an impact on the device’s electrical properties, and well-designed packaging reduces signal deterioration and improves overall performance.
  2. Thermal Control: Modern ICs produce a lot of heat. Heat dissipation is facilitated by efficient packaging designs, which helps avoid overheating and ensures long-term dependability.
  3. Form Factor & Size: As electronics get smaller and more portable, miniature packaging techniques make it possible to make devices that are svelte and tiny.
  4. Protection: Different packaging types protect the IC from various conditions including moisture, dust, and temperature changes. The packaging acts as a shield to protect the semiconductor die from these factors.
  5. Interconnect Density: The number of interconnects that may be accommodated depends on the kind of packaging. Complex interconnections are made possible by high-density packing, such as BGAs and CSPs, which is essential for contemporary electronics.

Techinsights images of Wafer level chip scale-type packaging

Samsung Exynos 9110 Processor

Figure 1 Samsung Exynos 9110 Processor (Source)

Apple A14 Bionic Processor (APL1W01)
Apple A14 Bionic Processor (APL1W01)

Figure 2 Apple A14 Bionic Processor (APL1W01) (Source)

IP Trends in Wafer-Level Chip Scale Packaging in Semiconductor

As the importance of packaging is increasing, there is a rapid growth in the patent filing trends witnessed across the globe. The Highest number of patents granted was in 2020 with 3339 patents and the highest number of patent applications filed was ~4553 in 2022.

IBM is a dominant player in the market with ~9319 patent families. So far, it has 1.5 times more patent families than TSMC, which comes second with 5686 patent families. Samsung is the third-largest patent holder in the domain.

Other key players who have filed for patents in WLCSP technology are Intel, Micron, Globalfoundries, SanDisk, Infineon Technology, SK Hynix and so more.

Key players who have filed for patents in WLCSP technology

(Source: Lens.org)

Legal status of patent applications
Patent Documents over Time with Publiation Date

(Source: Lens.org)

Conclusion

IC packaging is a crucial step in the semiconductor business because it shields semiconductor components from corrosion and physical harm from the outside world. The many distinct varieties of IC packages are based on various circuit designs and requirements for the outside shell. The most popular IC packaging designs are wafer-level packaging, pin grid arrays, dual in-line packages, quad flat packages, compact outline J-lead packages, and chip carriers. The IC package you choose depends on the particular application requirements.

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Mechanical

Intellectual Property and ChatGPT: Navigating the Ethical Landscape

Chatgpt, intellectual property

As cutting-edge artificial intelligence chatbots become progressively modern, they are bringing up significant questions about IPR law and its application to these new advances. Specifically, there are worries about the ownership of content produced by artificial intelligence chatbots, and how to protect and manage the content made by AI.

One main point of interest is the degree to which artificial intelligence chatbots can be thought of as “creators” of original content for reasons of copyright regulation. As these frameworks become further developed, they can produce even better pictures, texts, and different types of content that are indistinguishable from content made by humans. This brings up issues about who should be thought of as the “creator” of the substance for copyright, and whether such content ought to be qualified to be given similar IP rights.

As a rule, copyrighted materials are made by human creators and are considered original content that is fixed in a substantial form. This implies that the work should be communicated in a physical or computerized form, like a book, a PC file, or a painting, to be safeguarded by intellectual property law. With regards to artificial intelligence chatbots, it is not clear whether the substance produced by these frameworks would be viewed as original and fixed in a substantial form, and consequently qualified for copyright protection law.

Cheap and cheerful: why ChatGPT is no trademark filer | Managing Intellectual Property

Some might contend that artificial intelligence is simply a tool or instrument that is utilized by human creators for work, and subsequently, the human creator ought to be viewed as the original maker and proprietor of the work. Others might contend that computer-based intelligence itself ought to be viewed as the maker and proprietor of the work, provided its capacity to produce unique substance without any intervention by a human.

It is challenging to say for certain whether the substance produced by computer-based intelligence would be qualified for copyright law under existing regulations. Nonetheless, the rise of these advancements brings up significant questions and difficulties that should be addressed to guarantee that IP rights are safeguarded.

Another issue is the potential for IP infringement by artificial intelligence chatbots. As these frameworks become all the more broadly utilized, there is a gamble that they may coincidentally or purposefully produce content that encroaches on the Intellectual Property rights of others or that is duplicative of other artificial intelligence-created content. For instance, an AI chatbot that produces text or pictures in light of previous work without consent could be considered encroaching.

The development of cutting-edge artificial intelligence devices raises significant concerns related to IP that should be addressed to guarantee that these innovations are utilized ethically and that respect the rights of human creators. Technologists, attorneys, and policymakers should cautiously consider these issues and work together to foster fitting legal structures for the utilization of artificial intelligence in the production of original content.

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Computer Science Electronics

PayPal, Apple Pay Accused of Patent Infringement by Fintiv

PayPal, Apple Pay Accused of Patent Infringement by Fintiv

Mobile payments and commerce platform Fintiv has hit PayPal and Apple Pay with a claim on charges of patent infringement. Fintiv documented a comparative claim against Walmart as well.

Fintiv blamed PayPal for infringing five of its licenses connected with payments functionality, as per court reports. The suit Fintiv brought against Walmart charges that proprietary secrets were utilized improperly. The claim additionally charges that the retail goliath infringed a similar installment patent as PayPal, explicitly, utilizing phone innovation to process payments.

“These three cases are pretty significant for the tech community as a whole,” says Court Coursey, a director with Fintiv. “If you see one of these cases become a victory, I think you’ll see the rest become license deals pretty quickly.”

The complaint against PayPal was documented recently and looks for harms, sovereignties, and related court and legal expenses, plus interest.

“We’re talking billions of dollars here,” Sol Saad, a Florida tech investment banker, told in certain reports. His firms have advised Fintiv in the past. “This would include future royalties but also back payments for prior years of infringement.”

“Fintiv has a strong patent portfolio of over 150 patents, in addition to a large number of patent continuations and patents pending,” Saad told in reports. He explained that Mozido, Fintiv’s predecessor company, invented and patented the ideas necessary to create the mobile payments before the technology to power those ideas had been developed and has followed up with subsequent patents as the technology to support them emerged.

Mozido, Fintiv’s ancestor organization, established a phone-based payment settlement business with Western Union and Radio Shack in early 2008.

Fintiv at first hit Apple with a claim in December 2018. In October 2019, Apple documented a request to take a gander at the licenses. Apple was denied the patent review in May 2020. A trial was initially set for March 2021.

Presently the trial is planned for June in United States District Court for the Western District of Texas in June 2022.